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ACP Dispensing Module
MIYACHI EUROPE developed the ACP Dispensing Module for ACP Bonding Technology, which can be installed on all Miyachi Europe Systems. The ACP Dispensing Module has a linear movement to position the needle valve over the bonding pads. Dispensing position and the amount of ACP material are easily adjustable.
Interposer Module
This module is used to protect the Hot-Bar and the products during the bonding process and also to improve the bond strength. Especially on the PCB side, the interposer module forces the adhesive to fill the gaps between the tracks, which is creating a strong mechanical connection.
Alignment Module
If your parts require a very accurate (fine-pitch) alignment, we recommend to use an Optical Alignment Module. This includes a CCD camera with a special lens, special illumination, monitor and power supplies. The optical system magnifies and displays the track on the monitor. Operator speed and operator accuracy will surely increase.
Product Jig Module
Using the high quality MIYACHI EUROPE product jigs ensures optimum process quality. Product jigs are extremely important because bonding quality is influenced by co-planarity of the jigs, fine-alignment of the parts and materials used for the supporting blocks. We have many years of experience making jigs for a broad range of applications and processes. Ask our sales specialists about these modules.