ESEN ELEKTRONİK LTD.
English
HSB-CH-System
NH-3000A Series Heat‑Seal Bonding System CH
(formerly known as MHSB)
Heat-Seal / ACF Final Bonding is the process of creating electrical conductive adhesive bonds between flexible and rigid circuit boards, glass panel displays and flex foils. This interconnection technique is mostly used for connecting displays to PCB's.

The Heat-Seal / ACF Final Bonding systems are an integral part of The Hot Bar Series using Constant Heat technology through the integrated system temperature controller, a pneumatic Bond Head and customized thermodes.

The product range includes various models with different proudct handling features such as linear slides and rotary tables. The systems are designed considering ergonomic standards offering maximized production output. All process parameters are embedded into the system ensuring consistent process quality and operator independence.

The systems are enable full automatic process control with manual (un-)loading of parts. Each system can be adapted to suit the customers technical requirements through extension with optional plug & play modules. All modules are mounted on a robust frame contruction. The system offers the best stability supporting applications down to the finest pitch.

Key features NH-3000 Series ACF Final Bonding system PH:
 
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ESEN ELEKTRONİK MÜH. DAN. SAN. VE TİC. LTD. ŞTİ.
Yaylagül Sk. 8/4 A. Ayrancı 06690 ANKARA TÜRKİYE
Tel:+90 312 468 8114                Faks:+90 312 468 8115