ESEN ELEKTRONİK LTD.
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Bonding Heads
ACF Laminating/Pre-Bonding desktop systems
At the heart of the Desktop ACF Laminating system is the ACF module. This module positions the ACF tape accurately above the pre-loaded parts in the tooling. Prior to laminating / pre-Bonding the ACF to the substrate, the ACF tape is pre-cut at the required length of ACF from a reel of ACF. It is cut using the half-cut method which cuts the actual ACF material. The cover-layer is used for tape transport. The ACF is now positioned over the bond surface. By placing the Hot Bar on the ACF material the laminating / pre-Bonding is achieved. After the pre-bonding cycle the head moves back to the upper position and the carrier tape is peeled off through the automatic separator module. The use of the optional Sarcon Interposer Module between the Hot Bar and the ACF is recommended.
 
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ESEN ELEKTRONİK MÜH. DAN. SAN. VE TİC. LTD. ŞTİ.
Yaylagül Sk. 8/4 A. Ayrancı 06690 ANKARA TÜRKİYE
Tel:+90 312 468 8114                Faks:+90 312 468 8115