Heat-Seal/ACF Final Bonding Desktop Systems
The Desktop Series deliver the same high bonding quality as the larger and more automated systems. For production environments where labour costs are conservative, it offers an ideal price-performance (throughput) ratio. The flexibility of the system also makes it perfectly suited to R&D environments and integration into larger systems.
Key Features Heat-Seal/ACF Final Bonding Desktop Systems:
- Small and flexible systems for high quality connections
- Ideal price-performance (throughput) ratio
- Simple adjustable frame construction
- For Heat-Seal bonding, Hot Bar Reflow Soldering and Heat Staking
- Reliable process control, by proven technology of Uniflow Power Supply
