Hot Bar Reflow Soldering & Bonding

Hot Bar technology is used to transfer a defined programmable heating curve into a dedicated area,
in order to create an electromechanical interconnection between one or more materials.
Depending on the material specifications, part design and required functionality of the end product,
a specific Hot Bar process can be used.

Methods:

• Hot Bar Reflow Soldering
• Heat-Seal Bonding
• ACF Laminating
• ACF Final Bonding
• Heat-Staking

P R O D U C T S